Semiconductor Packaging Process flow

Complete SemiconductorProcessus packaging flow

Wafer Dicing: laganum totum dividens in singulos dies nudis

Mori Bonding: Adscendens alea super tabulam plumbeam vel subiectam

Filum Bonding: Coniungens alea pads ad plumbum frame utens auri vel filis aeris

Corona: Encapsulating peri ambitus in epoxy resinae ad tutelam

Sanatio: Obduratio et encapsulant ad stabilitatem augendae ponens

Deflashing & Molendum: removere excessus materiam fingendi et levandi superficiem metam

Duc Plating: plumbum plumbum ducit ad impediendam oxidationem et ad meliorem solidabilitatem

Laser Vestigium: Sculptura exemplarium numerorum, batch codicem, ac specificationes

Duc Trimming & Formans: Ducit absolutum Separans ac flectens in figuram debitam

Electrical Testis: comprobans connectivity electrica, functionality et intentione resistendi facultatem

Visual Inspectio: Protegendo pro defectibus visualibus, accuratione dimensiva et vitia medicamine

Tape & Reel Packaging: Packaging perfecti cogitationes pro horreis ac amet